Tag Archives: Technical Specifications

Hi5’s 2014 investment ends with black hole (machine!)

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2014 saw us bid a fond farewell to our venerable Resco Black Hole machine and welcome our new improved machine, manufactured by Lantronic of Holland. What is the Black Hole process? In order to make the holes in a printed circuit board conductive (prior to the copper plating stage), we need to apply a microscopically […]